Equipo De Embalaje De Semiconductores De Alta Precisión

Dirección: 301A, Bldg. D, No. 50, carretera Nanhuan, comunidad Shiwei, calle Matian, distrito de Guangming, Shenzhen, Guangdong, China
Teléfono: 86-18823383970-8:30-17:30
Fax: 86-18823383970
Correo electrónico: wenzhanhucai@163.com
Tiempo de trabajo: 8:30-17:30

Name: Equipo de embalaje de semiconductores de alta precisión
Uploaded: 2026-02-07CST01:59:28-06:00
Duration: 38 s
Description: Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.

Grupo: Otros vídeos

Tiempo de lanzamiento: 2025-04-24

Palabra clave: Equipo de línea SMT

Descripción del vídeo

Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.